Ge-industrial-solutions Austin Lynx SMT Manuel d'utilisateur télécharger pdf (Page 18)

Data Sheet

September 10, 2013

Austin Lynx

SMT Non-isolated Power Modules:

3.0 – 5.5Vdc Input; 0.75Vdc to 3.63Vdc Output; 10A output current

LINEAGE POWER 18

Surface Mount Information

Pick and Place

The Austin Lynx

SMT modules use an open frame

construction and are designed for a fully automated

assembly process. The modules are fitted with a

label designed to provide a large surface area for pick

and place operations. The label meets all the

requirements for surface mount processing, as well as

safety standards, and is able to withstand reflow

temperatures of up to 300

C. The label also carries

product information such as product code, serial

number and location of manufacture.

Figure 35. Pick and place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by

using open frame construction. Even so, these

modules have a relatively large mass when compared

to conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and pick &

placement speed should be considered to optimize

this process. The minimum recommended nozzle

diameter for reliable operation is 3mm. The maximum

nozzle outer diameter, which will safely fit within the

allowable component spacing, is 12 mm max.

Tin Lead Soldering

The Austin Lynx

SMT power modules are lead free

modules and can be soldered either in a lead-free

solder process or in a conventional Tin/Lead (Sn/Pb)

process. It is recommended that the customer review

data sheets in order to customize the solder reflow

profile for each application board assembly. The

following instructions must be observed when

soldering these units. Failure to observe these

instructions may result in the failure of or cause

damage to the modules, and can adversely affect

long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process

peak reflow temperatures are limited to less than

235

C. Typically, the eutectic solder melts at 183

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

the plating on the connection to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convection, IR (radiant

infrared), or a combination of convection/IR. For

reliable soldering the solder reflow profile should be

established by accurately measuring the modules CP

connector temperatures.

REFLOW TEMP (°C)

10 0

15 0

200

250

300

Preheat zo ne

max 4

-1

Soak zone

30-240s

Heat zone

max 4

-1

Peak Temp 235

Co oling

zo ne

1- 4

-1

lim

above

205

REFLOW TIME (S)

Figure 35. Reflow Profile for Tin/Lead (Sn/Pb)

process.

MAX TEMP SOLDER (°C)

200

205

210

215

220

225

230

235

240

0 102030405060

Figure 36. Time Limit Curve Above 205

C Reflow

for Tin Lead (Sn/Pb) process.

1 2 ... 13 14 15 16 17 18 19 20

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Ge-industrial-solutions Austin Lynx SMT Manuel d'utilisateur Page 18

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